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Lead Free Solder Bar
| No. |
Alloy Composition |
Composition |
Melting Point |
Sp. Gravity |
Packing |
Remarks |
| B67 |
Sn-Cu |
SN/CU0.7 |
228℃ |
7.3 |
1Kg / 5Kg |
Extrusion type |
| B33 |
Sn-Ag |
SN/AG3 |
218℃ |
7.4 |
1Kg / 5Kg |
Extrusion type |
| B35 |
Sn-Ag |
SN/AG3.5 |
221℃ |
7.4 |
1Kg / 5Kg |
Extrusion type |
| B0305 |
Sn-Ag-Cu |
SN/AG0.3/CU0.5 |
221℃ |
7.4 |
1Kg / 5Kg |
Extrusion type |
| B0307 |
Sn-Ag-Cu |
SN/AG0.3/CU0.7 |
221℃ |
7.4 |
1Kg / 5Kg |
|
| B3051 |
SN-Ag-Cu-Sb |
SN/AG3/CU0.5 |
217℃ |
7.4 |
1Kg / 5Kg |
|
- US Patent No. 5405577
- Japan Patent No. 2752258
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